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match performance by providing a little more capacitance – However, the impedance variation (profile) is complex behavior; so, many other possible approaches may be available - for instance, a
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Jan 15, 2009 · land. The thermal land varies in size depending on the PowerPAD package being used, the PCB construction, and the amount of heat that needs to be removed. In addition, this thermal land may or may not contain thermal vias, depending on PCB construction. The requirements for thermal lands and thermal vias are detailed in SLMA002 and SLMA004. Thermal design tool provides link to Allegro PCB Editor Flomerics released a new version of its thermal design tool, which features a link to Cadence's Allegro PCB Editor printed circuit board layout system. Cadence tops 52-week high as EDA stocks surge Shares of major EDA companies capped the week...
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